专利摘要:
In a vertical probe card (1), the needles (5), which are bent (bent) at least once, are passed between the plates (3, 4) through at least one insulating plate (7), the insulating plate (7) forming a frame (8 ) which is provided on its opposite sides with unidirectional fiber layers (9, 10), said fiber layers (9, 10) having electrically insulating fibers which are aligned at a right angle to each other. In practice it can be provided that a unidirectional fiber fabric (9) at the top of the frame (8) of the insulating plate (7) and the other unidirectional Fasergelege (10), in which the fibers at an angle of 90 ° to the one Fasergelege (9) are aligned on the underside of the frame (8) of the insulating plate (7) are mounted.
公开号:AT511398A1
申请号:T646/2011
申请日:2011-05-09
公开日:2012-11-15
发明作者:
申请人:Gaggl Rainer Dr;
IPC主号:
专利说明:

The present invention relates to an apparatus for electrically contacting semiconductor devices (microchips) and other miniaturized electrical devices approximately perpendicular to the surface of the device to be contacted contact pins arranged.
The contacting of semiconductor wafer wafers for electrical testing is typically accomplished by pressing (fine) probes onto the respective pads on the device (microchip) In one embodiment of probe cards, the probes are oriented approximately perpendicular to the surface of the device. Needle cards with this type of electrical contacting are called " vertical probe cards " or " vertical probe cards " designated.
Here, the needles are passed through at least two provided with holes, spaced apart plates. With respect to the contact points to the component (microchip) out the holes in the plates are arranged so that the needle tips are aligned with the corresponding pads (pads) on the device (microchip).
When contacting the microchip, the probe card after the first touch is still delivered to a certain extent (contact delivery), so that any differences in length between the individual contact needles are compensated and a sufficient contact force of the needles is reached on the contact surfaces (contact force). In this case, the needles are pushed through the holes of the component (microchip) facing plate sliding inside, in the space between the two plates. The needles buckle elastically resilient. The originally approximately stretched form of the 2
Needles is elastically deformed into an arcuate shape. The extent of buckling of the needles (that is, the size and shape of the arch) depends on the height of the contact delivery of each individual test needle. Since the direction in which the buckling takes place is not always the same, there is a risk that individual needles touch in the bent area. With non-insulated needles there is a risk of an electrical short circuit. To prevent this, the needles are often electrically insulated by means of a coating. The application of an insulating layer on the usually very small and fine needles is associated with a considerable effort.
Other arrangements attempt to achieve defined directions of buckling, for example, by aligned fitting of pre-bent needles (Cobra " technology). However, this requires restrictions regarding possible contact arrangements.
FR 2 815 127 A describes the separation of the buckling needles from one another by one or more insulating plates arranged approximately in the middle between the plates provided with bores and movable (displaceable) perpendicularly to the needles. The insulating plates can on the one hand pretend by appropriate bias the direction of the bending movement of the needles and on the other hand prevent contact of the needles with each other by the leadership of the needles in the holes of the insulating.
In this measure, the test needles from each other by insulating plates in distance to keep and thus isolate each other, the movements of the individual needles are mechanically coupled to each other. This can lead to unreliable contact behavior, especially with different needle lengths. Namely, those of the surface of the device, e.g. the wafer surface, located at the next 3, longer needles first and cause a deflection of the movably mounted insulating plate, which in turn allows the surface of the device not yet touching needles with buckle before they touch the contact surfaces on the device in the wafer. The same occurs when the arrangement of FR 2 815 127 A tilted on a wafer is placed, so the geometrically spanned by the needle tips plane to the surface of the device (wafer surface) is inclined.
The invention is based on the object of further developing a probe card ("vertical test card" or "vertical needle card") of the type mentioned at the outset so that the described disadvantages of the construction according to FR 2 815 127 A can not occur.
This object is achieved according to the invention with a probe card, which has the features of claim 1.
Preferred and advantageous embodiments of the invention are the subject of the dependent claims.
Since in the probe card according to the invention instead of the holes for the needles having insulating (at least) an insulating plate is provided which has intersecting fibers of electrically insulating material is given in the probe card according to the invention to a predeterminable extent, a sufficiently large independence of the movements of the needles. Nevertheless, it is reliably ensured that the needles are held apart from each other, so they can not touch each other and so shorts are avoided.
In a preferred embodiment, the insulating board provided in the probe card of the present invention comprises two unidirectional fiber webs, the fibers being at an angle in each other, with an angle of 90 ° being preferred.
In a practical embodiment, a unidirectional fiber layer may be provided on the top of the insulating board and the other fiber layer on the underside of the insulating board.
In a practical embodiment, the insulating plate has a frame which carries the fiber fabric.
The insulating plate according to the invention can be arranged in the needle card fixed or (in its plane) displaceable.
An essential advantage of the probe card according to the invention is that the movements of the needles are adequately decoupled from one another by using the insulating plate designed according to the invention, so that they can produce electrical contact with contact surfaces in the component almost independently of one another.
Further details and features of the invention will become apparent from the following description of a preferred embodiment with reference to the drawings. It shows:
1 is a sectional view of an inventive needle card,
2 shows a detail of the probe card from FIG. 1 and FIG. 3 schematically shows an insulating plate of the probe card according to the invention.
In the case of the embodiment of a vertical needle card 1 shown in the drawings, two plates 3, 4 are secured to a base plate 2 at a distance from one another via holders 11, 13. Between the plates 3,4 a plurality of needles 5 (only a few shown!) Is provided. The needles 5 in 5 of the base plate 2 closer plate 4 are firmly clamped and passed through it to map on the not visible in Fig. 1 side of the vertical needle card 1 in a manner not shown, to be connected to the tester.
In the upper in Fig. 1, that is remote from the base plate 2 plate 3, the bent formed needles 5 are slidably received and are available with their contact tips 6 through the upper plate 3. It should be noted that the needles 5 in their standby position, that is, when the vertical needle card 1 has not yet reached a component to be tested, instead of being bent (" buckled ") in the relaxed state as shown in Figs could be. It should be pointed out that the vertical needle card 1 shown in FIGS. 1 and 2 is used so that the contact tips 6 of the needles 5 point downwards, that is, the vertical needle card 1 is placed on the component from above. In the position of use of the vertical needle card, the plate 3 down, on the device to be tested out.
In the area between the plates 3, 4, the needles 5 are guided in an insulating plate 7, which has a frame 8 arranged between the plates 3, 4 and two unidirectional fiber layers 10, 11.
It is provided in practice that a unidirectional Fasergelege 9 on one side (top) of the frame 8 and the other fiber fabric 10 on the other side (bottom) of the frame 8 are attached.
The insulating plate 7 is received via its frame 8 in grooves 11 in the mounted on the base plate 2 of the vertical probe card 1 carrier 12. In this case, the insulating plate 7 relative to the vertical needle card 1 stationary or with respect to the 6th
Base plate 2 of the vertical needle card 1 in a parallel to itself and the base plate 2 level (limited) to be displaced
The fiber webs 9, 10 are formed by electrically insulating fibers, in particular glass fibers, wherein a fiber density is selected so that between each adjacent needles 5 each about ten (glass) fibers are provided. This is achieved in a simple manner in that each 10 pm, for example, about ten (glass) fibers are provided (in Fig. 3, the fibers of the fiber fabric 9, 10 are shown only symbolized!), Which in itself a thickness of 1 to 5 pm.
Because the needles 5 protrude between the plates 3, 4 of the probe card 1 through the unidirectional fiber fabric 9, 10 having insulating plate 7, they are mechanically decoupled from each other, so that each needle 5 can largely bend independent of other needles 5, if the probe card 1 to a device to be tested, eg a microchip is put on. This is true even if the vertical needle card 1 and the device to be inspected are not aligned with each other in parallel.
An advantage of the invention is also that the (at least one) insulating plate 7 provided with the unidirectional fiber layers 9, 10 in the probe card 1, unlike the insulating plate of FR 2 815 127 A, is not slidable parallel to the plates 3, 4 have to be.
In summary, an embodiment of the invention can be described as follows.
In a vertical probe card 1, the needles 5, which are buckled (bent) at least once, passed between the plates 3, 4 through at least one insulating plate 7, wherein the insulating plate 7 has a frame 8, which at its opposite sides with unidirectional Fasergelegen 9, 10, wherein the fiber webs 9, 10 comprise electrically insulating fibers which are aligned at a right angle to each other.
In practice it can be provided that a unidirectional fiber web 9 at the top of the frame 8 of the insulating plate 7 and the other unidirectional fiber web 10, in which the fibers are aligned at an angle of 90 ° to the one fiber web 9, at the bottom of the Frame 8 of the insulating plate 7 are attached.
权利要求:
Claims (8)
[1]
8 claims: 1. vertical needle card (1) with a plurality of test probes (5), which pass through and preferably curved plates (3, 4), the needles (5) extending between the plates (3, 4) through an insulating plate (7), characterized in that the at least one insulating plate (7) has a frame (8) on which two unidirectional fiber webs (9, 10) are mounted, and in that the fibers of one fiber web (9) to the fibers of the other fiber web (10) aligned at an angle,
[2]
2. Card according to claim 1, characterized in that the angle is 90 °.
[3]
3. Card according to claim 1 or 2, characterized in that the one fiber layer (9) on one side of the frame (8) and the other fiber layer (10) on the opposite side of the frame (8) is arranged.
[4]
4. Card according to one of claims 1 to 3, characterized in that between adjacent needles (5) five to fifteen, in particular ten fibers of each of the fiber fabric (9,10) are provided.
[5]
5. Card according to one of claims 1 to 4, characterized in that the fibers of the fiber fabric (9,10) consist of electrically insulating material.
[6]
6. Card according to claim 5, characterized in that the fibers are glass fibers.
[7]
7. Card according to one of claims 1 to 6, characterized in that the fiber density of the unidirectional fiber fabric (9, 10) is about ten fibers per 10 pm. 9
[8]
8. Card according to one of claims 1 to 7, characterized in that the fibers of the fiber fabric (9, 10) have a thickness of lpm to 5pm.
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同族专利:
公开号 | 公开日
AT511398B1|2013-02-15|
引用文献:
公开号 | 申请日 | 公开日 | 申请人 | 专利标题
EP0344654A2|1988-06-01|1989-12-06|Manfred Prokopp|Process and interface for contacting test objects|
JPH09304432A|1996-05-10|1997-11-28|Mitsubishi Electric Corp|Measuring instrument with deviation preventing function|
FR2815127A1|2000-10-05|2002-04-12|Andre Sabatier|ELECTRIC CONNECTOR WITH MULTIPLE CONTACTS|AT14209U1|2013-09-24|2015-06-15|T I P S Messtechnik Gmbh|Device for the electrical testing of semiconductor devices|
AT14210U1|2014-01-20|2015-06-15|Rainer Dr Gaggl|Vertical Adel map|
法律状态:
优先权:
申请号 | 申请日 | 专利标题
ATA646/2011A|AT511398B1|2011-05-09|2011-05-09|VERTICAL NEEDLE CARD|ATA646/2011A| AT511398B1|2011-05-09|2011-05-09|VERTICAL NEEDLE CARD|
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